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| 55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-0805-Y Features ! 2.0mmx1.25mm SMT LED, 1.1mm THICKNESS. ! LOW Description The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. ! WIDE VIEWING ANGLE. ! IDEAL FOR BACKLIGHT AND INDICATOR. AND LENS TYPES AVAILABLE. ! VARIOUS COLORS ! PACKAGE : 2.0x1.25mm SMD CHIP LED LAMP 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE:NOV/02/2002 PAGE: 1 OF 4 Selection Guide Iv (mcd) Iv (m c d ) (mcd d @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 100 120 Viewing Viewin g View in i Angle Par t No.. Pa No art No. Dice ic Lens Typ L ens Ty p e ens Typ s Ty GHB-0805-Y S UPER BRIGHTYELLOW (InGaAlP) WATER CLEAR 36 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current e D ev i c e evic Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p.. Ty p yp 590 588 28 25 2.0 2.5 10 x Max .. ax Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s I F=20mA I F=20mA I F=20mA V F =0V;f =1MHz I F=20mA V R = 5V Absolute Maximum Ratings at TA=25 C P a r a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w Su uper Br ht Ye Brig Yellow Brigh Yello B Y 125 30 150 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.3 DATE:NOV/02/2002 PAGE: 2 OF 4 REV NO: V.3 DATE:NOV/02/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) 8 REV NO: V.3 DATE:NOV/02/2002 PAGE: 4 OF 4 |
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